Capitalizing on its record earnings, SK Hynix unveiled a game-changing $14 billion investment—the largest private outlay in Indiana history—to build a cutting-edge chip packaging hub near Purdue University. The project, benefiting from CHIPS Act subsidies, will focus on:
Strategic Expansion Details:
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3.5 million square foot campus near Purdue University
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2,000 high-tech jobs created by 2027
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Dedicated HBM packaging lines for AI chips
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First-of-its-kind co-located R&D center
“We’re bulletproofing our AI chip supply chain by bringing this critical packaging capability stateside,” Kwak emphasized, with the Indiana plant slated to process 40% of SK Hynix’s HBM production for U.S. clients by 2028.
The move comes as:
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78% of Hynix’s HBM customers are U.S. firms
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CHIPS Act provides $3.2B in grants/tax incentives
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Geopolitical risks mount in Asian supply chains
