TSMC’s technological edge drove its stellar Q1 performance, with 3nm process technology now contributing 35% of revenue – the fastest node transition in company history. Key milestones:
• Yield rates: Achieved 80% on 3nm vs 60% for Intel
• 2nm progress: Risk production ahead of schedule
• Packaging: CoWoS capacity doubled to meet AI demand
“Nobody can match our execution,” said CTO Y.J. Mii, revealing:
✓ 18% performance gain over competing 3nm nodes
✓ 12% better power efficiency than Samsung
✓ 92% defect-free wafer rate
The roadmap ahead:
→ 2nm mass production Q1 2026
→ 1.4nm development 30% complete
→ 3D IC stacking for AI accelerators
